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Xiaomi XRING O3 – world’s first 3nm chip with LPDDR6 support
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Did they finally figure out how to do lithography without ASML?
TMSC is producing it in Taiwan.
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title: "Xiaomi XRING O3 debuts – world’s first 3nm chip with LPDDR6 support"
url: "https://www.huaweicentral.com/xiaomi-xring-o3-chip/"
author: "Emiko Matsui"Xiaomi today launched the XRING O3 mobile chip with 3nm process tech. It will show up with the Xiaomi 18 Fold smartphone next month. The company also revealed how the new self-developed chipset version differs from the past generation.
The tech giant hosted the Xiaomi XRING Chip Technology Communication Conference today, where it introduced its new-generation 3nm processor – XRING O3.
It is the first AI flagship mobile processor with major advancements. The tech maker has listed the respective chip on AnTuTu, where it scored 5228014 points.
During the event, Xiaomi revealed that XRING O3 comes with an upgraded chip architecture. It runs on TSMC’s 3nm process technology and has more than 24 billion transistors – a 26% increase compared to the XRING O2 chip.
XRING O3 is the world’s first mobile chipset to support LPDDR6 and delivers speeds up to 10,667Mbps with a memory bandwidth of 113.8GB/s – 48% more than XRING O1. It further has a die size of 133mm².
The new chip has undergone noteworthy changes – from AI to NPU and other chip components. The company has revamped it for its MiMo on-device AI models with up to 200 TPOS of tensor performance and 3.13 TFLOPS of vector performance.
(Image Credits: Weibo)
In addition, Xiaomi has improved power efficiency and responsiveness of the new chip with a revamped internal architecture. Thus, it offers 82ns latency.
AI performance for XRING O3 has been increased by 45%. Other changes for the chipset include two CPU AI acceleration units and eight neural-network GPU accelerators that expand the chip’s AI capabilities to a greater extent.
Besides the XRING O3, the Xiaomi chip briefing talked about XRINGO100 – an AI accelerator for large language models. It is the first to feature a 6nm 3D wafer-on-wafer advanced stacking design and provides 1.22TB/s bandwidth.
On the other hand is the XRING D100 – the first 3nm high-compute AI chip for smart driving in China.l
My money is on Xiaomi becoming larger than Samsung soon.
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My money is on Xiaomi becoming larger than Samsung soon.
not if the western world keeps black listing their phones at a rate slow enough to keep westerners unaware that it's happening.
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not if the western world keeps black listing their phones at a rate slow enough to keep westerners unaware that it's happening.
the west isn't the majority of the world, so i guess they'll hear it from somewhere else or xiaomi can still be super relevant world wide without that market.
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Who makes it?
the workers
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TMSC is producing it in Taiwan.
Ha, lol.
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title: "Xiaomi XRING O3 debuts – world’s first 3nm chip with LPDDR6 support"
url: "https://www.huaweicentral.com/xiaomi-xring-o3-chip/"
author: "Emiko Matsui"Xiaomi today launched the XRING O3 mobile chip with 3nm process tech. It will show up with the Xiaomi 18 Fold smartphone next month. The company also revealed how the new self-developed chipset version differs from the past generation.
The tech giant hosted the Xiaomi XRING Chip Technology Communication Conference today, where it introduced its new-generation 3nm processor – XRING O3.
It is the first AI flagship mobile processor with major advancements. The tech maker has listed the respective chip on AnTuTu, where it scored 5228014 points.
During the event, Xiaomi revealed that XRING O3 comes with an upgraded chip architecture. It runs on TSMC’s 3nm process technology and has more than 24 billion transistors – a 26% increase compared to the XRING O2 chip.
XRING O3 is the world’s first mobile chipset to support LPDDR6 and delivers speeds up to 10,667Mbps with a memory bandwidth of 113.8GB/s – 48% more than XRING O1. It further has a die size of 133mm².
The new chip has undergone noteworthy changes – from AI to NPU and other chip components. The company has revamped it for its MiMo on-device AI models with up to 200 TPOS of tensor performance and 3.13 TFLOPS of vector performance.
(Image Credits: Weibo)
In addition, Xiaomi has improved power efficiency and responsiveness of the new chip with a revamped internal architecture. Thus, it offers 82ns latency.
AI performance for XRING O3 has been increased by 45%. Other changes for the chipset include two CPU AI acceleration units and eight neural-network GPU accelerators that expand the chip’s AI capabilities to a greater extent.
Besides the XRING O3, the Xiaomi chip briefing talked about XRINGO100 – an AI accelerator for large language models. It is the first to feature a 6nm 3D wafer-on-wafer advanced stacking design and provides 1.22TB/s bandwidth.
On the other hand is the XRING D100 – the first 3nm high-compute AI chip for smart driving in China.l
RE: xiaomi 18 fold :
- likely initially china only
- actual ram type is unknown
-
title: "Xiaomi XRING O3 debuts – world’s first 3nm chip with LPDDR6 support"
url: "https://www.huaweicentral.com/xiaomi-xring-o3-chip/"
author: "Emiko Matsui"Xiaomi today launched the XRING O3 mobile chip with 3nm process tech. It will show up with the Xiaomi 18 Fold smartphone next month. The company also revealed how the new self-developed chipset version differs from the past generation.
The tech giant hosted the Xiaomi XRING Chip Technology Communication Conference today, where it introduced its new-generation 3nm processor – XRING O3.
It is the first AI flagship mobile processor with major advancements. The tech maker has listed the respective chip on AnTuTu, where it scored 5228014 points.
During the event, Xiaomi revealed that XRING O3 comes with an upgraded chip architecture. It runs on TSMC’s 3nm process technology and has more than 24 billion transistors – a 26% increase compared to the XRING O2 chip.
XRING O3 is the world’s first mobile chipset to support LPDDR6 and delivers speeds up to 10,667Mbps with a memory bandwidth of 113.8GB/s – 48% more than XRING O1. It further has a die size of 133mm².
The new chip has undergone noteworthy changes – from AI to NPU and other chip components. The company has revamped it for its MiMo on-device AI models with up to 200 TPOS of tensor performance and 3.13 TFLOPS of vector performance.
(Image Credits: Weibo)
In addition, Xiaomi has improved power efficiency and responsiveness of the new chip with a revamped internal architecture. Thus, it offers 82ns latency.
AI performance for XRING O3 has been increased by 45%. Other changes for the chipset include two CPU AI acceleration units and eight neural-network GPU accelerators that expand the chip’s AI capabilities to a greater extent.
Besides the XRING O3, the Xiaomi chip briefing talked about XRINGO100 – an AI accelerator for large language models. It is the first to feature a 6nm 3D wafer-on-wafer advanced stacking design and provides 1.22TB/s bandwidth.
On the other hand is the XRING D100 – the first 3nm high-compute AI chip for smart driving in China.l
Just looking at numbers, this thing is impressive. No small cores but still lower power than the XRING O1, 10 cores, huge GPU. It's actually going blow-for-blow against the 2nm next generation, based on the revealed or leaked specs. Not bad for their second attempt.
I want to see power consumption numbers, specially when cranking all those cores, cause that multicore performance is nuts.
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the west isn't the majority of the world, so i guess they'll hear it from somewhere else or xiaomi can still be super relevant world wide without that market.
yeah, the hauwei route seems to be the only avenue that western world can't stop them; but i'm still salty about my xiaomi being blacklisted in the united states despite having had used it for almost 2 years before hand -- it's the nicest phone i've ever had and now it's a paperweight. lol
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Did they finally figure out how to do lithography without ASML?
Certainly not this company.
It's Huawei that decided to move forward with technology the US doesn't have and they disclose their new technology, thus "it's spyware".
Xiaomi is more like 'the retail company of China' and thus less of an innovator, so they've decided to keep using US technology.
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